Specifications
Type
Picosecond Laser
Wavelength Region
VIS
Power
>50 W
Pulse Energy
200 µJ
Pulse Width
ps
Wavelength
1064 nm
Type
Picosecond Laser
Wavelength Region
VIS
Power
>50 W
Pulse Energy
200 µJ
Pulse Width
ps
Wavelength
1064 nm
Resources & Downloads
Data Sheets
Literature
Drawings & CAD
Selection Guides
Application Notes
- Laser Contact Opening (LCO) + Plating as a Sustainable Solution for TOPCon Solar Cells(1.9 MB, PDF)
- SiC Scribing with High-Power ps Lasers and the Advantages of TimeShift(1.3 MB, PDF)
- High-Index Glass for Augmented Reality Eyewear Cut with Infrared Picosecond Lasers(1.9 MB, PDF)
- System-In-Package (SiP) Materials Cutting with Green Picosecond Lasers(1.7 MB, PDF)
- Lithium-Ion Battery Foil Cutting with Picosecond IR Lasers and Burst Mode(1.3 MB, PDF)
- New Foldable OLED Display Materials Cut with Picosecond UV Laser(2.8 MB, PDF)
- New Materials in 5G Flex Circuits Process with Picosecond UV Lasers(1.1 MB, PDF)
- High Quality Cutting of Thin Glass and Sapphire with Icefyre® ps Laser(1.1 MB, PDF)
- Glass Micro-Welding with Picosecond Lasers(645.6 kB, PDF)
- OLED Materials Processing with High Power UV Picosecond Lasers(435.3 kB, PDF)
- High Quality Flex Printed Circuit (FPC) Processing with UV ps Lasers(474.8 kB, PDF)
- High Quality, High Throughput Glass Processing with the IceFyre® ps Laser(536.1 kB, PDF)
- PSO Motion Capability for Fast, Variable Speed Trajectory Processing(448.1 kB, PDF)
- Burst Machining of Copper and Stainless Steel with IceFyre® ps Laser(1.8 MB, PDF)
- Picosecond Laser Burst Machining of Silicon(1.4 MB, PDF)
- High Speed Processing of Plastics with a 100 W fs Laser(468.5 kB, PDF)
- Micromachining Transparent, Brittle Materials(447.7 kB, PDF)
Technical Articles
